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Principal Engineer, Research - Job Opportunity at Nexperia Germany GmbH

Hong Kong, Hong Kong
Full-time
Senior
Posted: April 26, 2025
On-site
USD 150,000 - 200,000 per year based on Hong Kong market rates for senior semiconductor roles and regional compensation trends

Benefits

Inclusive work environment with dedicated D&I initiatives
Employee resource groups including Pride Network and Women's groups
Career development and coaching opportunities
Global company exposure and networking opportunities

Key Responsibilities

Lead technical package development strategy and architectural roadmap planning
Drive cross-functional alignment for new semiconductor package specifications
Oversee process integration and quality assurance for assembly processes
Guide technical discussions and decision-making across internal and external stakeholders
Ensure market alignment and technological innovation in package development
Facilitate knowledge transfer and technical communication within project teams

Requirements

Education

Bachelor/Master/PhD in Mechanical Engineering/Material Sciences related or equivalent

Experience

Minimum 10 year experience in R&D environment especially in Semiconductor Process engineering/Design/Development

Required Skills

Knowledge of WLCSP/Embedded packages/SIP packages technologies Strong knowledge in FMEA, SPC, DoE & troubleshooting skills/toolsets Strong problem solving skill AutoCAD / Solidworks skills Comprehensive knowledge of semiconductor packaging processes and equipment Active learning and knowledge sharing abilities Coaching capabilities
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Sauge AI Market Intelligence

Industry Trends

The semiconductor packaging industry is experiencing rapid evolution with increasing demand for advanced packaging solutions, particularly in response to heterogeneous integration needs and the rise of AI/ML applications. There's a significant shift towards more sophisticated packaging technologies like System-in-Package (SiP) and embedded die solutions, driven by the need for higher performance and miniaturization. The Asia-Pacific region, particularly Hong Kong and surrounding areas, continues to be a crucial hub for semiconductor packaging innovation and manufacturing.

Role Significance

Typically leads a technical team of 5-8 engineers while collaborating with cross-functional teams of 15-20 members
This is a senior technical leadership position with significant influence on company's technological roadmap and product development strategy

Key Projects

Advanced packaging architecture development for next-generation semiconductor products Process integration optimization for complex semiconductor assemblies Technical roadmap development and implementation Cross-functional technology alignment initiatives

Success Factors

Deep technical expertise combined with strategic business acumen Strong stakeholder management and communication abilities across cultural boundaries Ability to drive innovation while maintaining practical manufacturing considerations Experience in balancing technical excellence with market requirements

Market Demand

Very high demand due to the global semiconductor industry expansion and increasing complexity of packaging requirements, particularly in Asia-Pacific markets

Important Skills

Critical Skills

Advanced packaging technology expertise is crucial as it directly impacts product development and market competitiveness Process integration knowledge is essential for ensuring manufacturing feasibility and quality Leadership and communication skills are vital for driving cross-functional collaboration and technical innovation

Beneficial Skills

Project management capabilities enhance effectiveness in coordinating complex technical initiatives Business acumen helps in aligning technical solutions with market needs Knowledge of emerging packaging technologies provides advantage in future-proofing developments

Unique Aspects

Strong emphasis on diversity and inclusion with concrete initiatives and goals
Direct involvement in cutting-edge packaging technology development
Combination of technical leadership and strategic market alignment responsibilities

Career Growth

2-4 years in role before advancement, depending on project success and organizational growth

Potential Next Roles

Technical Director Head of R&D Chief Technology Officer VP of Engineering

Company Overview

Nexperia Germany GmbH

Nexperia is a leading global semiconductor manufacturer specializing in discrete components, logic, and MOSFETs

Major player in the discrete semiconductor market with strong presence in automotive and industrial sectors
Strategic position in Hong Kong serving as key technical hub for Asian operations
Innovation-driven environment with strong focus on technical excellence and diversity inclusion
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  • Salary estimates and market demand analysis
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  • Critical success factors and key skills
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