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Staff/Principal Engineer, Product Engineering, Media Health Manufacturing, HIG-HBM - Job Opportunity at Micron Technology, Inc.

Singapore, Singapore
Full-time
Senior
Posted: August 25, 2025
On-site
Based on the senior technical leadership role, Singapore location, and Micron's market position, the compensation package likely ranges from SGD 180,000 to SGD 280,000 annually (USD 130,000 to USD 200,000), potentially including significant equity components and performance bonuses given the critical nature of HBM technology to Micron's strategic objectives.

Benefits

Inclusive team environment that promotes diversity and belonging in a competitive tech industry
Opportunity to work on cutting-edge High Bandwidth Memory (HBM) technology that directly impacts AI and neural network advancements
International travel opportunities to US, Taiwan, and Japan for global collaboration and exposure
Professional development through mentorship responsibilities and cross-functional leadership
Access to state-of-the-art semiconductor manufacturing facilities and advanced CAD tools
Contribution to sustainability initiatives and community giving programs that enhance corporate social responsibility

Key Responsibilities

Drive strategic test coverage optimization across all current and future HIG HBM design architectures, directly impacting manufacturing efficiency and product quality in high-volume production environments
Lead end-to-end product development lifecycle for next-generation HBM products, from initial validation through market qualification, ensuring competitive positioning in the rapidly growing AI memory market
Provide technical leadership in design verification and circuit analysis using advanced CAD tools and Verilog simulations, enabling faster time-to-market for critical memory solutions
Execute yield improvement initiatives targeting DRAM, Interface, and Stacked Die components, directly contributing to cost reduction and profitability targets while maintaining quality standards
Resolve complex manufacturing test flow issues and handle qualification and RMA device problems, ensuring customer satisfaction and product reliability in mission-critical applications
Champion innovation initiatives that establish Micron's technical competitive advantage in the HBM market, influencing future product roadmaps and technology direction
Develop and mentor engineering talent across multiple disciplines, building organizational capability and succession planning for critical technical roles
Lead cross-functional project management initiatives ensuring timely delivery of technological solutions that align with business objectives and market demands
Make strategic technical decisions on risk analysis and project prioritization that directly impact product development timelines and resource allocation
Orchestrate collaboration between Fab, Technology Development, Design, System Development, and Quality teams to ensure holistic product development and successful market introduction

Requirements

Education

Bachelor's/Master's Electrical and Electronics Engineering Degree

Experience

7+ years of experience in the semiconductor industry with Product Engineering experience preferred

Required Skills

Strong Leadership Skills and Technical Skills, especially in problem solving with root cause understanding and solution space through in depth circuit analysis Good knowledge of statistics and data analysis tools and scripting Dedicated and highly motivated with a flexible approach towards adapting to different roles in a dynamic working environment Proven track record of collaborative work within/across teams to address sophisticated business and engineering problems Strong sense of responsibility and accountability towards assigned role with professional work ethic Excellent communication and presentation skills Passionate about people leadership, with a drive toward ongoing learning and development
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Sauge AI Market Intelligence

Industry Trends

The explosive growth of artificial intelligence and machine learning applications is driving unprecedented demand for High Bandwidth Memory (HBM) solutions, with market projections showing compound annual growth rates exceeding 30% through 2028. This trend is particularly pronounced in data center applications, autonomous vehicles, and advanced graphics processing units where memory bandwidth has become a critical performance bottleneck. Semiconductor manufacturing is experiencing a significant shift toward advanced packaging technologies and 3D stacking solutions, with HBM representing one of the most technically challenging and commercially valuable segments. Companies are investing heavily in yield optimization and test methodologies to maintain competitive positioning in this high-stakes market. The geopolitical landscape is reshaping semiconductor supply chains, with increased emphasis on regional manufacturing capabilities and talent development in key markets like Singapore, which serves as a critical hub for Southeast Asian semiconductor operations and advanced packaging technologies. Industry 4.0 and smart manufacturing initiatives are revolutionizing semiconductor production, with data-driven approaches to yield optimization, predictive maintenance, and quality control becoming essential competitive advantages in high-volume memory manufacturing.

Role Significance

Typically manages or influences a cross-functional team of 15-25 engineers across multiple disciplines including test engineering, product validation, design verification, and manufacturing support, while also coordinating with global teams across multiple time zones and cultural contexts.
This is a high-impact senior individual contributor or team lead position that combines deep technical expertise with strategic leadership responsibilities. The role sits at the intersection of product development, manufacturing excellence, and technology innovation, making it critical to Micron's competitive positioning in the rapidly expanding HBM market segment.

Key Projects

Next-generation HBM product launches targeting AI accelerators and high-performance computing applications Yield optimization initiatives that can impact millions of dollars in manufacturing costs and customer satisfaction Design-for-test strategy development that influences future product architectures and manufacturing scalability Cross-site technology transfer projects enabling global manufacturing capability and capacity expansion

Success Factors

Deep understanding of semiconductor physics, memory architectures, and advanced packaging technologies combined with practical manufacturing experience that enables rapid problem-solving in high-pressure production environments Exceptional cross-cultural communication and leadership skills necessary for managing complex global projects involving teams across multiple continents with different working styles and technical approaches Strategic thinking capability that balances short-term manufacturing objectives with long-term technology roadmap requirements, ensuring both immediate business needs and future competitive positioning are addressed Data-driven decision-making skills using advanced statistical analysis and machine learning techniques to identify patterns in complex manufacturing data and drive continuous improvement initiatives Strong business acumen to understand customer requirements, market dynamics, and competitive landscape factors that influence technical decisions and resource allocation priorities

Market Demand

Extremely high demand driven by the convergence of AI boom, memory bandwidth requirements, and limited global talent pool with specialized HBM expertise. This represents one of the most sought-after skill sets in semiconductor industry with supply significantly lagging demand.

Important Skills

Critical Skills

Circuit analysis and semiconductor device physics expertise is absolutely essential as this role requires deep understanding of failure mechanisms, yield limiters, and optimization opportunities at the transistor and circuit level in complex 3D stacked memory architectures Statistical analysis and data science capabilities are critical for identifying patterns in large manufacturing datasets, developing predictive models for yield optimization, and making data-driven decisions that impact millions of dollars in production costs Cross-functional leadership and program management skills are vital for orchestrating complex projects involving multiple engineering disciplines, global teams, and tight interdependencies between design, manufacturing, and customer requirements Advanced problem-solving methodology and root cause analysis capabilities are essential for resolving complex technical issues that span multiple layers of technology stack from device physics to system-level interactions

Beneficial Skills

Machine learning and artificial intelligence knowledge for developing advanced yield prediction models and automated test optimization algorithms that can provide significant competitive advantages in manufacturing efficiency Customer application understanding particularly in AI accelerators, graphics processing, and high-performance computing to better align product development with market requirements and emerging use cases Business and financial analysis skills to evaluate trade-offs between technical solutions and commercial objectives, enabling more effective resource allocation and strategic decision-making in competitive market environments Emerging memory technologies knowledge including processing-in-memory, neuromorphic computing, and quantum applications to position for future market opportunities and technology transitions

Unique Aspects

This role uniquely combines manufacturing excellence with cutting-edge product development in one of the semiconductor industry's most technically challenging and commercially critical areas, offering exposure to both high-volume production and advanced R&D activities
The position provides rare opportunity to influence global technology standards and industry roadmaps, as HBM specifications and test methodologies developed in this role may become industry benchmarks adopted by competitors and customers alike
International scope with regular collaboration across multiple continents provides exceptional exposure to diverse engineering approaches, customer requirements, and market dynamics that few engineering roles can offer
Direct impact on artificial intelligence revolution through memory solutions that enable breakthrough capabilities in machine learning, autonomous systems, and advanced computing applications

Career Growth

Progression to director-level positions typically occurs within 3-5 years for high performers, with principal engineer track progression possible within 2-4 years depending on technical contributions and industry impact. Executive roles generally require 5-8 years of additional experience building broader business and organizational capabilities.

Potential Next Roles

Director of Product Engineering with expanded organizational responsibility covering multiple product lines and strategic technology initiatives Principal Engineer or Distinguished Engineer track focusing on advanced memory technologies and next-generation architecture development General Manager or VP level positions overseeing entire business units or regional operations in the memory industry CTO or Chief Engineer roles at emerging companies developing specialized AI hardware or advanced memory solutions

Company Overview

Micron Technology, Inc.

Micron Technology stands as one of the world's largest memory and storage manufacturers, competing directly with Samsung and SK Hynix in the global memory market. The company has established itself as a leader in DRAM, NAND flash, and emerging memory technologies, with particular strength in data center and automotive applications that require high-performance memory solutions.

Micron holds approximately 20-25% global market share in DRAM and maintains a strong position in the rapidly growing HBM segment, which is critical for AI and high-performance computing applications. The company's focus on advanced technology nodes and specialized products has enabled premium pricing and strong margins despite cyclical industry challenges.
Singapore serves as a crucial manufacturing and engineering hub for Micron's Asia-Pacific operations, housing advanced packaging facilities and serving as a bridge between global headquarters and key Asian customers. The location provides strategic access to the world's largest semiconductor ecosystem while offering political stability and strong intellectual property protection.
Micron emphasizes technical excellence, innovation, and collaborative problem-solving in a fast-paced, results-oriented environment. The company culture rewards both individual technical contributions and cross-functional leadership, with strong emphasis on continuous learning and adaptation to rapidly evolving technology landscapes.
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